Flexible installation and removal across assembly, testing, and service workflows
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The Detachable 2D Fiber Array Unit (Detachable 2D FAU) connects multi-channel fiber arrays to silicon photonic integrated circuits (PICs). Its two-dimensional, multi-row fiber architecture increases channel density within a constrained package footprint, while the detachable interface allows the optical assembly to be installed or removed as needed during assembly, testing, and service workflows.
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Hero Image Upload Area | Recommended Size: 1920 × 900 or Larger Flexible installation and removal across assembly, testing, and service workflows
A high-density 2D fiber architecture designed to support continued CPO scaling
A patented dual-meta-lens collimated optical architecture supports multi-channel, multi-row array coupling, enabling a detachable FAU architecture for CPO systems.
Image Slot: Dual Meta-lens Coupling Architecture Integrates multi-row, multi-channel fibers within a constrained package footprint to support higher optical channel density.
Provides a wider alignment tolerance at the fiber-array-to-PIC interface, supporting greater flexibility in optical packaging and scalable manufacturing integration.
Reduces fiber-to-PIC coupling loss to maintain efficient optical signal transmission.
Image Slot: 12-inch Meta-lens Wafer The meta-lens design is compatible with mainstream 12-inch CMOS and silicon photonics process platforms, supporting a path toward volume manufacturing with consistent product performance and high optical coupling efficiency.
Designed around downstream packaging and test workflows, the architecture helps simplify assembly, alignment, and testing while reducing system-integration complexity.
Image Slot: Packaging and Test Integration
Watch the Technology Overview Image Slot: Technology Video Poster By combining a high-density 2D fiber architecture with a detachable interface, the Detachable 2D FAU supports continued CPO scaling and the high-performance optical connectivity requirements of AI and communications modules.
Contact us to discuss how the Detachable 2D FAU can align with your system architecture, packaging workflow, and channel configuration.
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