Company Overview
From Meta-optics toScalable CPO Optical I/O
AuthenX applies meta-optics to optical I/O coupling interfaces for silicon photonics, developing high-density optical interconnect products for co-packaged optics (CPO) systems supporting AI GPU cluster interconnects.
Founded in 2019 and headquartered in Hsinchu, Taiwan, AuthenX brings integrated capabilities spanning silicon photonics (SiPh) device design, high-speed optoelectronic module packaging, and commercial product development.
A Customizable, Scalable CPO Optical I/O Platform
AuthenX’s core product is the Detachable 2D Fiber Array Unit (Detachable 2D FAU). By integrating meta-lens technology with a detachable two-dimensional fiber-array architecture, the product creates a high-density optical interface between fiber arrays and silicon photonic integrated circuits.
To address different channel-count and system-generation requirements, AuthenX continues to develop configurable product solutions designed to support 3.2T, 6.4T, and 12.8T CPO optical interconnects, with scalability and volume-manufacturing integration as core design considerations.
Meta-lens
Applying meta-optics to optical I/O coupling interfaces for silicon photonics, establishing the core technology foundation for high-density optical interconnect products.
Detachable
2D FAU
A detachable two-dimensional fiber-array architecture that creates a high-density optical I/O interface between fiber arrays and silicon photonic integrated circuits.
View Product Details3.2T–12.8T CPO
Configurable for different channel-count and system requirements, and designed to support multiple generations of CPO optical interconnects with scalability and volume-manufacturing integration in mind.
From Device Design to Manufacturing and Inspection
With deep expertise in optical communications, optoelectronic integration, and materials science, our technical team has established integrated capabilities spanning device development, packaging, productization, and volume-production validation.
Silicon Photonics & Optical I/O Design
Key Design Challenges and Solutions in Integrating Silicon Photonics, Metalenses, and Optical I/O
Packaging & Productization
Taiwan-based In-House Line: From Advanced Packaging & Testing to AI-Driven Commercial Products.
Volume Manufacturing & Optical Inspection
Developing in-house processes for meta-lens production and inspection, as well as packaging and optical-performance testing for meta-lens-integrated two-dimensional fiber arrays.
Technology matters not only for the limits it overcomes,but for what it enables our customers to build.